论文论著展开
[1] Sun, Y.; Dai, P.; Liu, Y.; Liu, C. A Feature-Fusion Deep Reinforcement Learning Framework for Multi-Configuration Engineering Drawing Layout. Algorithms 2026, 19, 226.(SCI四区) https://doi.org/10.3390/a19030226
[2] Sun Y , Shi P , Chen T ,et al.MFET: Multi-frequency enhancement transformer for single-image super-resolution[J].Image and Vision Computing, 2010,(SCI三区) 163(000):14.DOI:10.1016/j.imavis.2025.105751.
[3] Sun Y , Shao Z , Yan B .IAGA: A New Method of Automatic Layout for Dimensioning Engineering Drawings[J].Technical Gazette / Tehnički Vjesnik, 2025, 32(1).DOI:10.17559/TV-20240127001297.
[4] Sun Yunlei and Li Yucong,A Hybrid GA-Powell Algorithm for Geometric Constraint Solving[J].Computer Science and Information Systems, 2024, 21(4).(SCI四区)
[5] Yunlei Sun, Bingyi Yan, and Zhaotong Shao,AI Large Models Bring Great Opportunities to Reusable Design of CAD Software[J].Computer Science and Information Systems, 2024, 21(4).(SCI四区)
[6] Sun,YL, Li YC,Liu KP ,et al.A Comprehensive Evaluation of the DFP Method for Geometric Constraint Solving Algorithm Using PlaneGCS[J].Technical Gazette / Tehnički Vjesnik, 2023, 30(6).(SCI四区)
[7] Sun Y , Liu K , Yucong L I ,et al.Towards an Open-Source Industry CAD: A Review of System Development Methods[J].Technical Gazette / Tehnički Vjesnik, 2022, 29(6).(SCI四区)
[8] Sun, Yunlei, et al. ATSN: Attention-Based Temporal Segment Network for Action Recognition,Tehnički vjesnik, vol.26, no. 6, 2019. (SCI四区)
[9] Sun, Yunlei. The Neural Network of One-Dimensional Convolution-An Example of the Diagnosis of Diabetic Retinopathy. IEEE Access. PP. 1-1.2019 (SCI二区)
[10] Sun, Yunlei, et al. Diagnosis and Analysis of Diabetic Retinopathy based on Electronic Health Records. IEEE Access. PP. 1-1. 2019. (SCI二区)
[11] Sun, Yunlei, Li, Yucong, et al.. Hyperparameter Importance Analysis based on N-RReliefF Algorithm. International Journal of Computers Communications & Control. 2019.(SCI四区)
[12] Sun, Yunlei, et al. Machine Learning Techniques for Screening and Diagnosis of Diabetes: a Survey, Tehnički vjesnik, vol.26, no. 3, pp. 872-880.2019 (SCI四区)